IV320-RS-X
IP66 Tactical Maritime Edge Computer
- AI Optimized IP66 Rugged Computer
- Enabling Persistent Maritime ISR with Autonomous, Coordinated USVs
- Support Intel® 14/13th Gen Raptor Lake-R/S, Core i9/i7
- Up to 64GB DDR5 5200 MHz SO-DIMM, non-ECC and ECC
- Rugged Waterproof M20/M12 connectors
- 2 x LAN (2.5GbE), 1 x COM ; 1 x miniDP ; 1 x USB3.0
- Extended Operating Temperature -20°C to +60°C
- MIL-STD-810 for Wide Temperature, Anti-Vibration, Shock
- Technical Profile
- Specifications
- Order Information
- Full IP66 Sealed Enclosure
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Dirt, dust, and moisture in outdoor environments can adversely affect system performance. Exposure to high humidity or dusty conditions may lead to operational failures. The IV320-RS-X features a fully IP66-rated sealed enclosure, specifically designed to meet the protection requirements of electrical and electronic systems. It provides reliable protection against dust ingress, condensation, water spray, and low-pressure water jets from any direction, making it suitable for most outdoor enclosure applications.
- Intel CPU Features
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To enable Edge AI capabilities, the IV320-RS-X is powered by Intel® 13th Gen Raptor Lake processors. This generation enhances overall performance through increased core counts—primarily via additional E-Cores—expanded L2 cache capacity, and higher clock speeds. Flagship configurations support up to 8 Performance Cores (P-Cores) and 16 Efficient Cores (E-Cores), delivering a total of 24 cores for demanding workloads.
The x86 hybrid architecture includes two distinct core types, dynamically allocating workloads to optimize performance and power efficiency based on application requirements:
P-Cores (Performance Cores): Built on the Golden Cove architecture, optimized for high-performance and compute-intensive tasks.
E-Cores (Efficient Cores): Based on the Gracemont architecture, designed for low-power operation and efficient multitasking.
- Appearance
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System |
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|---|---|
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CPU |
Intel® 14th Raptor Lake-R Core i9-14900T, 24C(8P+16E), 32T, 1.1/5.5GHz, 36M Cache, TDP 35W (Turbo mode 106W) |
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Memory type |
Up to 64GB DDR5 5200 MHz SO-DIMM, non-ECC and ECC |
|
Chipset |
Intel® Q670E/R680E Chipset |
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Expansion Slot |
1 x PCIe 4.0 x 16 |
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Storage |
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SATA |
2 x 2.5” SSD SATAIII Internal |
| TPM | |
| TPM | Onboard TPM2.0 |
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Front I/O |
|
| X1 | 1 x DC-IN w/M12 waterproof connector |
| X2 | 1 x 2.5Giga LAN w/M12 waterproof connector |
| X3 | 1 x 2.5Giga LAN w/M12 waterproof connector |
| X4 | 1 x RS232/422/485 w/M12 waterproof connector |
| X5 | 1 x USB3.0, with M20 waterproof connector |
| X6 | 1 x miniDP w/M20 waterproof connector |
| X7 | (reserve) |
| X8 | (reserve) |
| SSD LED | 1 x SSD LED |
| Switch | 1 x IP66 power button |
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Rear I/O |
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Others |
Antenna(Option) |
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GND |
1 x GND |
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Power |
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Power input |
18V~36V DC-IN |
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Operating System |
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OS |
Windows® 10 IoT Enterprise 2021 LTSC (64-bit, 21H2) |
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Physical |
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Dimension |
325 x 250 x 100 mm (W x L x H) |
|
Chassis |
Aluminum Alloy |
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Heatsink |
Heatsink Aluminum Alloy, Corrosion Resistant |
| FAN Kit | W/GPU SKU |
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Environmental |
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Green Product |
RoHS, WEEE compliance |
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Operating Temp. |
-20°C to +60°C |
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Storage Temp. |
-40°C to +85°C |
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Relative Humidity |
5% to 95%, non-condensing |
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MIL-STD-810 (Design To Meet) |
MIL-STD-810 Design to meet : Method 501, Operational Temperature, high / Procedure II: +50°C, two-hour dwell, four cycles Method 501, Storage Temperature, high / Procedure I: +70°C, two-hour dwell, four cycles Method 502, Operational Temperature, low / Procedure II: -20°C, two-hour dwell, four cycles Method 502, Storage Temperature, low / Procedure I: -40°C, two-hour dwell, four cycles Method 514, Vibration / Category 24/Non-Operating (Category 20 & 24, Vibration) Method 514, Vibration / Category 20/Operating (Category 20 & 24, Vibration) Method 516, Shock / Procedure V Non-Operating (Mechanical Shock) Method 516, Shock / Procedure I Operating (Mechanical Shock) |
